To cool this power system we find a huge heatsink that has twice the dissipation surface of its predecessors, heatsinks that conform to the design of the MOSFET to increase the thermal efficiency of the heatsink and improve airflow and heat exchange. This increase in thermal performance is due to the main heatsink has been manufactured in one piece and implements several air inlets that improve the cooling of the assembly and greater efficiency in the dissipation of the heat produced by the board power system. To top all this off, is also implemented.
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