The MSI MEG B550 Unify is the manufacturer’s most expensive B550 motherboard, which is also reflected in many points and functions. One can name here the power supply, the layout, the network connection, the audio solution and much more. That the rather discreet board is also suitable for overclockers is shown by the sibling model Unify-X, which only has two RAM banks and is also supposed to run particularly high memory speeds. However, the present sample should first be examined more closely.
ASRock uses a 10-phase power supply (8 CPU, 2 SOC). The electrical topology is similar to what we see on other relatively budget ASRock boards insofar as UPI doublers and PWM controller are allied to Vishay 50A MOSFETs. The B550M Steel Legend is closest in terms of specification. Get past these numbers and know that the power-delivery system pushes a maximum 400A for the CPU, which is plenty enough to generate 500W – or at least 2x anything we see from even a heavily overclocked Ryzen 9 5950X.
For specifications, the Unify is set up quite well with a 14+2 power design, MSI using Infineon stages this time around each able to handle 90A output current, plenty for the latest Zen 3 series. Of course, AM4 is the socket, and B550 is our chipset, so we have support for DDR4; 2133MHz JEDEC through 5100MHz via DOCP. Max memory is rated at 128GB across four slots.
At the top, this motherboard is built on the AMD B550 chipset with the AM4 socket. This offers compatibility across an entire ecosystem of processors that include 3000 and 5000 series Ryzen along with 4000 G Series. Memory is DDR4, supported across four slots from JEDEC 2133MHz to XMP 4866MHz. Max capacity is set at 128GB.
The eight-core 16-thread Ryzen 7 5700G marks the arrival of AMD’s first 7nm ‘Cezanne’ Zen 3 APUs for desktop PCs, and today we’re taking an early look at the chips. AMD plans to use the Cezanne chips to plug big price gaps in its Ryzen 5000 lineup that dominates our Best CPU list and CPU Benchmark hierarchy, but they’re limited to the OEM market until the full retail launch on August 5, 2021. Anticipation is high, though, so we grabbed an off-the-shelf system from HP to take the Ryzen 7 5700G for a spin.
EVGA released a short teaser video for what appears to be their first AMD based motherboard offering. Traditionally, EVGA has only offered up motherboard based off of Intel chipsets, but the times are changing…
[Taipei, Taiwan] At the beginning of June, MSI presented the brand-new X570S Series motherboards during MSI‘s online product launch event. The unique designs and remarkable features sparked widespread discussions. Here are more in-depth concrete details regarding the MSI MAG X570S Series.
In 2019, AMD’s X570 platform came out and became the first chipset that supports PCIe 4.0 solution. Even now, MSI X570 Series motherboards are undoubtedly a great lineup with high specifications and aggressive designs. However, MSI can’t just stop there. Our mission is to deliver the best computing experience for every gamer and creator. The new X570S Series motherboards achieved exactly that.
MSI is dedicated to product optimization so the new motherboards are made with prominent features. The MAG X570S Series is at the forefront of this launch. Inspired by military design, the MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX share identical looks. More excitingly, the MAG X570S TORPEDO MAX now comes in the Pacific Blue colorway, which is all the rage for our fans. Apart from the attractive designs, the imperative modification is the fanless chipset heatsink. We removed the fan to reduce dust and noise, while the ranges of the heatsink are expanded. Also, both MAG X570S TOMAHAWK MAX WIFI and MAG X570S TORPEDO MAX have M.2 Shield Frozr. The former has an All Aluminum Design while the latter has an Extended Heatsink Design. Therefore, the new MSI X570S Series motherboards enhance heat dissipation efficiency instead of sacrificing the heat dissipation performance.
In terms of the specifications, both MAG X570S Series motherboards feature 12 Duet Rail Power System with digital PWM IC to unleash the potential power of the processors. With 2 PCIe 4.0 x16 slots, both motherboards support multi-GPU CrossFire Technology. The MAG X570S Series motherboards are equipped with 2.5G LAN while the MAG X570S TOMAHAWK MAX WIFI supports the latest network solution Wi-Fi 6E for high-speed transmission. For the audio, the MAG X570S Series is upgraded to Audio Boost 5, which provides a high-tier audio experience.
Take it easy. MSI will launch new MPG and MEG Series motherboards as well and disclose the latest information on our channel. So stay tuned.
For more details, please check the product pages below:
Looking to be the top B550 board out there, the MEG B550 UNIFY has quite a bit going for it. From four M.2 slot,s three of which are Gen 4 (Take notes Intel) to WiFi 6 and more, the MEG B550 UNIFY looks like one hell of a board on paper! The all-black aesthetic is going to allow it to fit in nicely with almost any build and really give users full control over how they want things to look. Is RGB slowly dying off? I highly doubt it, but it is nice to see an option without it, Kudos MSI!
June 17th, 2021 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen™ 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets. The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.
“AMD is excited for the launch of new and innovative X570 motherboards, bringing even more offerings to the AMD socket AM4 platform,” said Chris Kilburn, corporate vice president and general manager, client component business unit, AMD. “These new motherboards will continue to showcase the groundbreaking performance of the AMD Ryzen™ 5000 Series processors, maximizing the potential for enthusiasts, gamers, and content creators alike.”
The entire X570S lineup integrates a 2.5 GbE high speed LAN while select X570S AORUS motherboards feature WIFI 6 with blazing fast 2.4 Gbps connection speeds, and even WIFI 6E 802.11ax wireless network, as well as front USB 3.2 Type-C® interface for more convenient usage. Moreover, select X570S AORUS motherboards equip USB 3.2 Gen 2×2 Type-C® for a more speedy data transfer up to 20 Gbps. GIGABYTE also release X570S AERO G for creators. With built-in the same level power materials, thermal planning, high-speed network, and 4 sets of PCIe 4.0 M.2 interfaces as other X570S motherboards, X570S AERO G also features the VisionLINK function that is well-received by the creators to provide them a more effective transform from ideas to creation.
“Providing users with the best product has always been Gigabyte’s mission, while the top-quality AMD platform motherboards with excellent compatibility, high efficiency and low temperature demonstrates our strong strength in the development of AMD motherboards. “said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. “ GIGABYTE’s X570S series motherboards are developed by gamers and professional designers who pursue performance, and are enhanced by the features of 16-phase direct digital power design, advanced VRM thermal design, silent cooling design without chipset fan, several PCIe 4.0 interfaces, blazing fast LAN, updated BIOS, and R&D’s adjustment. This series definitely impress the performance chaser by the performance and stability and become the perfect choice for high-end users who plans to assemble AMD platforms. ”
Diving into the N7 B550, this is an AM4 platform solution built on the AMD B550 chipset. CPU compatibility includes 3,4, and 5000 series processors coupled with support for DDR4 memory with speeds of 2133MHz through 3200MHz via JEDEC and 4733+ via XMP. The form factor is 288pin over four slots with a maximum capacity of 128GB.
Expansion slots include two x16 lanes PCI Express slots, one full x16 electrically Gen4, and one that is x4 electrically. Additionally, you will find two x1 lane slots that are Gen3. Storage is deployed over two m.2 slots; form factor supported 2242 through 2280. One slot operates in Gen4 mode with a four-lane connection and the other Gen3 x2 and SATA modes. An additional six SATA ports are available for legacy storage solutions.
